The results indicate that the reducing reaction of electrolyte on the foil with rough surface is much visible than on that with shiny surface,the dissolution potential of matte copper foil is 0.
结果表明,电解液在毛面铜箔表面发生还原反应的程度比在光面铜箔表面显著,其阳极溶解电位比光面铜箔约低0。
8 V lower than that of the shiny copper foil whi.
结果表明,电解液在毛面铜箔表面发生还原反应的程度比在光面铜箔表面显著,其阳极溶解电位比光面铜箔约低0。
This paper stated the characteristic of soldering for large dimension copper-clad laminates,and pointed out the difficulties of adopting SMT techniques to assemble it.
通过陈述大面积敷铜箔板的焊接特点,指出采用SMT工艺组装大面积敷铜箔板的难点;详细阐述了采用DFM原则提高设计质量、严格控制印膏质量和合理设置再流焊接温度曲线3个方面的试验过程。
