The process and equipment applied to producing silver powder and Pd-Ag powder in mass is introduced.
介绍了电子元件用高纯超细球形银粉、钯银合金粉的车间生产工艺及其生产线特点,探讨了影响粉末形貌的各个因素。
Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.
采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。
