Studies on water-soluble photoresists during the last decade have been summarized in two parts: traditional photochemical reaction type and chemically amplified type.
本文按传统光化学反应型和化学增幅型两种类型对近10年水溶性光致抗蚀剂的发展状况做了分类总结,并重点介绍了成像反应原理和各体系的优缺点。
Etchings of polyamic acid films based on ODA/BTDA or MPD/PMDA ,by means of an average acrylic acid dry film photoresist for etching of copper foils in printed circuits board industries ,used 4 % aqueous tetramethyammonium hydroxide(TMAH) as etchant, were prepared and converted to the corresponding etchings of polyimide by thermal treatment.
以普通丙烯酸光致抗蚀干膜为抗蚀层,采用对该抗蚀层进行二次UV曝光新工艺。
