6Cu and 63Sn37Pb were established based on creep law,and the stress-strain distribution of soldered joints in copper column grid array(CuCGA) devices was analyzed under the loadings of different temperature cycles.
6Cu和63Sn37Pb钎料的本构方程,分析铜柱栅阵列封装(CuCGA)器件在不同温度循环载荷下焊点的应力应变分布。
A 3D pattern synthesis method for cylindrical arrays based on adaptive array theory are presented in this paper.
基于自适应天线阵理论,研究共形阵的赋形算法,给出一种用于圆柱形阵列天线三维方向图的波束赋形算法。
