With the algorithm pattern synthesis for uniform and nonuniform arrays is performed and mainlobes and sidelobes can be controlled effectively as designed.
分别对等间距和不等间距阵列进行了方向图综合,都能够按设计要求有效地控制主瓣电平和副瓣电平,使其达到预期的效果。
The stress arising from falling is apt to cause the solder joint failure or even complete machine trouble, especially to the printed circuit board which mounted with TFBGA (Thin-profile fine-pitch ball grid array).
便携式电子产品因其小体积、低重量而在使用或运输过程中易被跌落或滑落或受冲击,因跌落引起的应力容易导致焊点失效乃至整机故障,对贴装有细间距球栅阵列封装元器件(TFBGA:Thin-profile fine-pitch ball grid array)的印制电路板尤为如此。
