With the novel modulated doping QW base and buried metal self-align process, the base lateral resistance and contact resistance of ultra-thin-base small-size SiGe HBTs are decreased by 42% and 55% respectively, which provides an effective method of resolution on base serial resistance.
采用新型调制掺杂量子阱基区结构和掩埋金属自对准工艺方法,在器件的纵向结构和制备手段上同时进行改进,使超薄基区小尺寸SiGeHBT的基区横向电阻和接触电阻分别降低42%和55%以上,有效解决了基区串联电阻的问题。
